发明名称 |
Insulating resin composition and application thereof |
摘要 |
The present invention provides a resin composition comprising: (A) a thermoplastic resin, (B) a granular material which has a number average particle diameter of 0.5 to 5 mm and is obtainable by granulating a fiber mainly having alumina with a number average fiber diameter of 1 to 50 μm, and (C) a filler composed of a material of which electric resistivity at 300 K is 102 &OHgr;m or less. The resin composition can be molded into a molded article with electric insulation. The electric resistivity of the molded article has sufficient electric insulation in applications such as in electric and electronic parts. |
申请公布号 |
US8258209(B2) |
申请公布日期 |
2012.09.04 |
申请号 |
US20080230424 |
申请日期 |
2008.08.28 |
申请人 |
KOMATSU SHINTARO;MAEDA MITSUO;HARADA HIROSHI;SUMITOMO CHEMICAL COMPANY, LIMITED |
发明人 |
KOMATSU SHINTARO;MAEDA MITSUO;HARADA HIROSHI |
分类号 |
C08K3/22;C08K7/04;C08K7/18;C08L101/00 |
主分类号 |
C08K3/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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