Thermal head manufacturing method

摘要

In a thermal head manufacturing method, at least one concave portion is formed on a surface of a first substrate, and a second substrate comprised of a first layer and a second layer that is denser and harder than the first layer is provided. The first and second substrates are bonded to one another so that the second layer of the second substrate covers the concave portion of the first substrate. The first layer of the second substrate is then etched until a surface of the second layer of the second substrate is exposed. At least one heating resistor is formed on the exposed surface of the second layer of the second substrate after the etching step so that the heating resistor is disposed over the concave portion of the first substrate.