发明名称 |
Method for fabricating chip elements provided with wire insertion grooves |
摘要 |
The invention relates to a method for fabricating chip elements provided with a groove from devices formed on a wafer. The method comprises the steps consisting in, depositing a sacrificial film on the wafer so as to leave a central part of each device exposed and to cover an edge of the device at the level of which the groove is to be formed; applying a mold on the sacrificial film; injecting a hardenable material into the mold; hardening the hardenable material; dicing the wafer between the devices; and eliminating the sacrificial film. |
申请公布号 |
US8258044(B2) |
申请公布日期 |
2012.09.04 |
申请号 |
US201113103533 |
申请日期 |
2011.05.09 |
申请人 |
COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIESALTERNATIVES |
发明人 |
BRUN JEAN;VICARD DOMINIQUE |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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