发明名称 |
Encapsulant interposer system with integrated passive devices and manufacturing method therefor |
摘要 |
A method of manufacturing a semiconductor package system includes: forming a leadframe having a passive device; encapsulating the passive device to form an encapsulant interposer; attaching a first die to the encapsulant interposer; forming a substrate interposer having a second die; and stacking the encapsulant interposer over the substrate interposer.
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申请公布号 |
US8258612(B2) |
申请公布日期 |
2012.09.04 |
申请号 |
US20100942084 |
申请日期 |
2010.11.09 |
申请人 |
KUAN HEAP HOE;HUANG RUI;LIN YAOJIAN;CHOW SENG GUAN;STATS CHIPPAC LTD. |
发明人 |
KUAN HEAP HOE;HUANG RUI;LIN YAOJIAN;CHOW SENG GUAN |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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