| 摘要 |
<p>PURPOSE: A solder ball manufacturing apparatus and method for a package are provided to easily compartmentalize various kinds of solder balls by coloring the solder ball with various colors. CONSTITUTION: A bumping unit(200) comprises a bumping channel. The bumping channel bumps a solder ball by using fused solder. A coloring agent feeding unit(110) is connected to the bumping channel. The coloring agent feeding unit offers coloring agent to the fused solder. A cooling unit(100) is connected to the bumping unit and cools the solder ball. The cooling unit is formed into a chamber shape. Inactivity gas or cooling oil is included in the cooling unit in order to cool the solder ball. A storage unit stores the cooled solder ball.</p> |
