| 发明名称 |
Integrated circuit package system with package integration |
| 摘要 |
An integrated circuit package system comprising: providing a substrate having a cavity; sealing a package over the cavity of the substrate; and forming an encapsulant over the package and a portion of the substrate substantially preventing the encapsulant from forming in the cavity.
|
| 申请公布号 |
US8258614(B2) |
申请公布日期 |
2012.09.04 |
| 申请号 |
US20070938371 |
申请日期 |
2007.11.12 |
| 申请人 |
CAMACHO ZIGMUND RAMIREZ;PISIGAN JAIRUS LEGASPI;ADVINCULA ABELARDO JR. HADAP;TAY LIONEL CHIEN HUI;STATS CHIPPAC LTD. |
发明人 |
CAMACHO ZIGMUND RAMIREZ;PISIGAN JAIRUS LEGASPI;ADVINCULA ABELARDO JR. HADAP;TAY LIONEL CHIEN HUI |
| 分类号 |
H01L23/06 |
主分类号 |
H01L23/06 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
