| 发明名称 |
Light emitting diode package including a lead frame with a cavity |
| 摘要 |
The present invention provides a light emitting diode package which includes a lead frame with a cavity; a mold exposing the cavity and housing the lead frame; and an LED chip mounted on the cavity, wherein light passing an upper edge of the LED chip passes an upper edge of the cavity. |
| 申请公布号 |
US8258526(B2) |
申请公布日期 |
2012.09.04 |
| 申请号 |
US20080204260 |
申请日期 |
2008.09.04 |
| 申请人 |
PARK YOUNG SAM;HAHM HUN JOO;KIM HYUNG SUK;HAN SEONG YEON;KIM DO HUN;KIM DAE YEON;KIM DAE HYUN;SAMSUNG LED CO., LTD. |
发明人 |
PARK YOUNG SAM;HAHM HUN JOO;KIM HYUNG SUK;HAN SEONG YEON;KIM DO HUN;KIM DAE YEON;KIM DAE HYUN |
| 分类号 |
H01L33/00 |
主分类号 |
H01L33/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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