发明名称 |
Semiconductor package having increased resistance to electrostatic discharge |
摘要 |
Embodiments of the invention include a semiconductor integrated circuit package that includes a substrate having an integrated circuit die attached thereto. The package includes a ESD shield attached to the substrate. The ESD shield configured to increase the ESD hardness of the package. The ESD shield can further serve to stiffen the package to prevent warping and operate as a heat spreader.
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申请公布号 |
US8258016(B2) |
申请公布日期 |
2012.09.04 |
申请号 |
US20080337519 |
申请日期 |
2008.12.17 |
申请人 |
ITO CHOSHU;LOH WILLIAM M.;PARTHASARATHY RAJAGOPALAN;LSI CORPORATION |
发明人 |
ITO CHOSHU;LOH WILLIAM M.;PARTHASARATHY RAJAGOPALAN |
分类号 |
H01L21/44 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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