发明名称 Substrate device with a transmission line connected to a connector pad and method of manufacture
摘要 A substrate device includes: a substrate; a ground layer disposed on one of two opposing surfaces of the substrate; a transmission line disposed on the other of the two opposing surfaces of the substrate; a pad which is disposed on the other of the two opposing surfaces of the substrate and connected to the transmission line; and a connector connected to the pad via a contact point. The pad has a part on the transmission line side and a part positioned on the opposite side of the transmission line with respect to the contact point with the connector which are electrically insulated from each other.
申请公布号 US8258888(B2) 申请公布日期 2012.09.04
申请号 US20090588731 申请日期 2009.10.26
申请人 OOTSUKA HIDETAKA;NEC CORPORATION 发明人 OOTSUKA HIDETAKA
分类号 H01P5/02 主分类号 H01P5/02
代理机构 代理人
主权项
地址