发明名称 |
Substrate device with a transmission line connected to a connector pad and method of manufacture |
摘要 |
A substrate device includes: a substrate; a ground layer disposed on one of two opposing surfaces of the substrate; a transmission line disposed on the other of the two opposing surfaces of the substrate; a pad which is disposed on the other of the two opposing surfaces of the substrate and connected to the transmission line; and a connector connected to the pad via a contact point. The pad has a part on the transmission line side and a part positioned on the opposite side of the transmission line with respect to the contact point with the connector which are electrically insulated from each other. |
申请公布号 |
US8258888(B2) |
申请公布日期 |
2012.09.04 |
申请号 |
US20090588731 |
申请日期 |
2009.10.26 |
申请人 |
OOTSUKA HIDETAKA;NEC CORPORATION |
发明人 |
OOTSUKA HIDETAKA |
分类号 |
H01P5/02 |
主分类号 |
H01P5/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|