发明名称 |
SIMULATING APPARATUS FOR SOLIDIFIED LAYER THICKNESS USING WATER MODEL MOLD |
摘要 |
PURPOSE: A device for simulating the thickness of a coagulation layer using a water model mold is provided to simulate the coagulation thickness of an actual mold by using a simulation unit capable of regulating an interval, thereby measuring and analyzing molten steel movement within the mold. CONSTITUTION: A device for simulating the thickness of a coagulation layer using a water model mold comprises a simulation unit(11), a fixing unit(20), and a transfer unit(30). The simulation unit is inserted into between fixing plates consisting a long side unit of a water model mold simulating the movement of molten steel and simulates the thickness of a coagulation layer by being formed in a short side unit of the water model mold. The fixing unit pushes an outer side of the fixing plate where the simulation unit is inserted and installed, thereby fixing the simulation unit and the fixing plates. The transfer unit is joined to the outer lower part of the simulation unit, thereby transferring the lower part of the simulation unit to inner and outer sides of the long side unit.
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申请公布号 |
KR20120097066(A) |
申请公布日期 |
2012.09.03 |
申请号 |
KR20110016389 |
申请日期 |
2011.02.24 |
申请人 |
HYUNDAI STEEL COMPANY |
发明人 |
KIM, KYUNG SOO;MOON, HONG KIL;YOO, SUK HYUN;HA, TAE JUN |
分类号 |
G01M10/00;B22D11/16;G09B25/02 |
主分类号 |
G01M10/00 |
代理机构 |
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地址 |
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