| 摘要 |
<p>PURPOSE: An embedded package and a formation method thereof are provided to enhance mounting efficiency of a semiconductor device by multiplying the number of semiconductor chips chip embedded in the inner side of a limited space. CONSTITUTION: A first sub substrate(100) comprises a first pad part(A1), a second pad part(A2), and a Borland(130). A second sub substrate(200) is attached on a first side(100A) of the first sub substrate by a first adhesive member(710). The second sub substrate comprises a third pad part(A3), a fourth pad part(A4), first through via(230), and a first opening part(240). A first semiconductor chip(400) is electrically connected to a first pad of the first sub substrate. A first connecting member(610) and a first dummy connecting member(620) are arranged between the first sub substrate and the first semiconductor chip.</p> |
