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发明名称
保护带的贴付剥离方法及使用此种方法之装置
摘要
在具有阶梯,且成为复数晶片的图案形成为格子状的物品表面,从与形成于上述物品表面的各图案间的凹部形成任意的角度的方向贴附保护带,其后,在保护带的表面,同样地以相对于上述物品表面的凹部之任意角度的方向剥离粘着带。
申请公布号
TWI371789
申请公布日期
2012.09.01
申请号
TW093138524
申请日期
2004.12.13
申请人
日东电工股份有限公司 日本
发明人
山本雅之
分类号
H01L21/304
主分类号
H01L21/304
代理机构
代理人
何金涂 台北市大安区敦化南路2段77号8楼
主权项
地址
日本
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