发明名称 |
PROCEDES ET DISPOSITIFS DE MISE SOUS CONTRAINTE D'UN CIRCUIT INTEGRE |
摘要 |
Disclosed is in particular a device (2) for stressing an integrated circuit (1) including an electronic chip (10) mounted in a housing (12), the device including a source (20) of thermal stress. The device (2) also includes a thermally conductive coupling member (22), designed to be thermally coupled to the source (20) of thermal stress during the stressing operation. The coupling member (22) includes an end (220) whose geometry is suitable for being introduced into an aperture with a predefined geometry, to be made in the housing (12) of the integrated circuit (1) so as to thermally couple a coupling face (222) of this end (220) with a face (102) of the electronic chip (10). |
申请公布号 |
FR2959018(B1) |
申请公布日期 |
2012.08.31 |
申请号 |
FR20100052978 |
申请日期 |
2010.04.20 |
申请人 |
EUROPEAN AERONAUTIC DEFENCE AND SPACE COMPANY EADS FRANCE;ASTRIUM SAS |
发明人 |
MOLIERE FLORIAN;MORAND SEBASTIEN;DOUIN ALEXANDRE;SALVATERRA GERARD;BINOIS CHRISTIAN;PEYRE DANIEL |
分类号 |
G01R31/311;H01L21/66 |
主分类号 |
G01R31/311 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|