发明名称 WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To facilitate insertion of an electronic component into an aperture while reducing the clearance between the aperture and the electronic component. <P>SOLUTION: A wiring board 10 with a built-in electronic component comprises a substrate 100 having a first surface F1, a second surface F2 on the reverse side of the first surface F1, and an aperture R10, and an electronic component 200 having a third surface F3, and a fourth surface F4 on the reverse side of the third surface F3, and being arranged in the aperture R10 so that the orientation of the third surface F3 is same as that of the first surface F1 of the substrate 100. The electronic component 200 has a curved surface at the corner of the side surface and the fourth surface F4, and the substrate 100 has a tapered surface C11 tapering from the first surface F1 toward the second surface F2 at the corner of the inner wall (side surface F10) of the aperture R10 and the first surface F1. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012164952(A) 申请公布日期 2012.08.30
申请号 JP20110155278 申请日期 2011.07.13
申请人 IBIDEN CO LTD 发明人 SHIMIZU KEISUKE;MIKADO YUKINOBU
分类号 H05K3/46;H01L23/12 主分类号 H05K3/46
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