| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition for low-dielectric underfill, which is a polyimide-based underfill material suitably usable in a polyimide circuit board, suppresses noises that are likely to develop in a high-frequency region, and can save power consumption; and to provide a cured film thereof. <P>SOLUTION: This resin composition for underfill is obtained by mixing: (A) polyimide or a polyamic acid being a precursor thereof; (B) a polyolefin particle having an average particle diameter of 100 μm or less; and (C) a solvent, where the cured film obtained by heating and drying the resin composition includes a continuous phase of polyimide and a dispersed phase obtained from the polyolefin particle (B); and the relative permittivity of the cured film is lower than that of the polyimide. <P>COPYRIGHT: (C)2012,JPO&INPIT |
