| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin sealing material for a semiconductor, which has excellent injectability, inhibits the formation of fillet cracks and voids, and inhibits a reduction in the glass transition temperature. <P>SOLUTION: The resin sealing material for a semiconductor comprises (A) an epoxy resin, (B) an amine curing agent, (C) a filler, (D) a core-shell rubber, and (E) a reactive diluent, wherein the reactive diluent (E) is formed from a compound having two or more glycidyl groups in one molecule and the amine curing agent (B) content is 0.5 to 1.5 equivalents per epoxy equivalent of epoxy resin (A) and reactive diluent (E). <P>COPYRIGHT: (C)2012,JPO&INPIT |
