| 摘要 |
Provided are an LED encapsulation bracket structure (1) and an LED device. The LED encapsulation bracket structure (1) is molded by a metal strip through stamping and electroplating, and formed by metal bracket units (2) arranged in a planar matrix. An electrode pin (21) of the bracket unit (2) is at the bottom. A surface of the bracket unit (2) is stamped with a groove (22), a locking hole (23), and a lock-shaped groove (24), which are used for ensuring a combining force of a subsequent encapsulation material and the bracket unit (2). The lock-shaped groove (24) specifies a size of the encapsulation material. A chip (3) is fixed in the stamped groove (22), the chip (3) is connected to the electrode pin (21) of the bracket unit (2) through a gold thread (4), and the welded bracket unit (2) is mounted and molded through the encapsulation material (5), thereby completing LED encapsulation. The LED encapsulation bracket structure (1) is molded through stamping in one step, and meanwhile the circuit structure is completed, thereby omitting the injection molding of the conventional bracket. Based on the requirements of the LED application, the LED encapsulation bracket structure (1) and the LED device can be encapsulated and cut randomly, and can be molded and used in a multi-chip or single-chip form. |
