发明名称 SUB-MOUNT, SUB-MOUNT ASSEMBLY AND SUB-MOUNT ASSEMBLY METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a sub-mount which is constructed not to easily incur increase in manufacturing costs and reduction in yield or reliability and has an aslant waveguide. <P>SOLUTION: A sub-mount 100 of the present invention is used to fix a semiconductor light-emitting element 10, equipped with a waveguide 11 consisting of a semiconductor material whose axis line is inclined &theta;<SB POS="POST">WG</SB>(degrees) relative to the normal line of the optical input/output end face and which has a refraction index of n<SB POS="POST">LE</SB>, in place. A first surface 101 on which a semiconductor light-emitting element is installed is provided with a fusion material layer 103 for fixing the semiconductor light-emitting element in place. An alignment mark 107 which can discriminate an angle &theta;<SB POS="POST">SM</SB>=sin<SP POS="POST">-1</SP>[n<SB POS="POST">LE</SB>*sin(&theta;<SB POS="POST">WG</SB>)/n<SB POS="POST">0</SB>], where n<SB POS="POST">0</SB>is the refraction index of a light passage medium in an outside vicinity of the optical input/output end face of the semiconductor light-emitting element, is formed on the fusion material layer 103. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012164737(A) 申请公布日期 2012.08.30
申请号 JP20110022540 申请日期 2011.02.04
申请人 SONY CORP;TOHOKU UNIV 发明人 WATANABE HIDEKI;KODA RINTARO;KURAMOTO MASARU;NAGANUMA KO;YOKOYAMA HIROYUKI
分类号 H01S5/022 主分类号 H01S5/022
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