发明名称 AIRTIGHT PACKAGE, METHOD FOR MEASURING MOISTURE CONTENT IN THE AIRTIGHT PACKAGE, AND METHOD FOR MEASURING LEAK RATE OF THE AIRTIGHT PACKAGE
摘要 <P>PROBLEM TO BE SOLVED: To provide an airtight package which allows a user to measure a dew point in the airtight package and obtain the accurate moisture content in the airtight package, and to provide a method for measuring moisture content in the airtight package and a method for measuring a leak rate of the airtight package. <P>SOLUTION: An airtight package according to this invention includes: a housing sealing an electronic device; a dew condensation sensor fixed to an inner wall of the housing; and a temperature sensor fixed to the housing and measuring a temperature of a position where the dew condensation sensor is fixed. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012164689(A) 申请公布日期 2012.08.30
申请号 JP20110021504 申请日期 2011.02.03
申请人 MITSUBISHI ELECTRIC CORP 发明人 MITSUYAMA HIROSHI;KOMINAMI MITSUJI;MOTODA TAKASHI;NANBARA SEIJI
分类号 H01L23/18;G01N27/04;H01L23/02 主分类号 H01L23/18
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