发明名称 |
AIRTIGHT PACKAGE, METHOD FOR MEASURING MOISTURE CONTENT IN THE AIRTIGHT PACKAGE, AND METHOD FOR MEASURING LEAK RATE OF THE AIRTIGHT PACKAGE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide an airtight package which allows a user to measure a dew point in the airtight package and obtain the accurate moisture content in the airtight package, and to provide a method for measuring moisture content in the airtight package and a method for measuring a leak rate of the airtight package. <P>SOLUTION: An airtight package according to this invention includes: a housing sealing an electronic device; a dew condensation sensor fixed to an inner wall of the housing; and a temperature sensor fixed to the housing and measuring a temperature of a position where the dew condensation sensor is fixed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012164689(A) |
申请公布日期 |
2012.08.30 |
申请号 |
JP20110021504 |
申请日期 |
2011.02.03 |
申请人 |
MITSUBISHI ELECTRIC CORP |
发明人 |
MITSUYAMA HIROSHI;KOMINAMI MITSUJI;MOTODA TAKASHI;NANBARA SEIJI |
分类号 |
H01L23/18;G01N27/04;H01L23/02 |
主分类号 |
H01L23/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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