发明名称 ABRASIVE RECOVERY METHOD AND ABRASIVE RECOVERY DEVICE
摘要 Provided are an abrasive recovery method and abrasive recovery device capable of recovering a slurry comprising a highly-concentrated abrasive while avoiding increases in pressure loss and large decreases in the recovery rate due to membrane blocking. A device (1) for recovering an abrasive from a used polishing slurry which has been used in a CMP process has a separation membrane (41) with a cylindrical hole passage into which the used polishing slurry is introduced. The hole passage of the separation membrane (41) is no more than 0.8m in length in an effective filtration unit. The abrasive recovery device (1) concentrates the abrasive of the used polishing slurry to a concentration of 10 mass% or greater.
申请公布号 WO2012114395(A1) 申请公布日期 2012.08.30
申请号 WO2011JP04593 申请日期 2011.08.16
申请人 NOMURA MICRO SCIENCE CO., LTD.;ISHII, KEIICHIRO;HIOKI, SHOJI 发明人 ISHII, KEIICHIRO;HIOKI, SHOJI
分类号 H01L21/304;B01D61/14;B01D61/58;B01D63/02;B01D63/06;B01D71/16;B01D71/26;B01D71/34;B01D71/36;B01D71/64;B01D71/68;B24B37/00;B24B57/00;C02F1/44 主分类号 H01L21/304
代理机构 代理人
主权项
地址