| 摘要 |
<p>A duplexer includes a package substrate having layers stacked, a transmission filter and a reception filter that are provided on an upper surface of a first layer that is one of the layers of the package substrate, the transmission and reception filters being acoustic wave filters, a metal pattern provided on the upper surface of the first layer and formed to surround the transmission and reception filters, a transmission line provided on an upper surface of a second layer that is one of the layers of the package substrate and is positionally lower than the first layer, the transmission line electrically connecting the transmission filter and a transmission terminal together, and a reception line that is provided on the upper surface of the second layer and electrically connects the reception filter and a reception terminal. The thickness of the first layer is greater than that of the second layer.Fig. 2</p> |
