| 摘要 |
<p>SHEET FOR PROTECTING SURFACE OF SEMICONDUCTOR WAFER, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR WAFER PROTECTION METHOD USING SHEETAbstractTo provide a semiconductor wafer surface protection sheet having good adhesion to irregularities on a patterned surface of a semiconductor wafer, and having good peelability after wafer grinding. Specifically, a semiconductor wafer surface protection sheet is provided that includes a base layer having a tensile elasticity at 25°C, EA (25), of 1 Gpa or more; a resin layer A that satisfies the condition EA (60)! EA (25) < 0.1, where EA (25) is a tensile elasticity at 25°C and where EA (60) is a tensile elasticity at 60°C, the EA (60) ranging from 0.005 MPa to 1 MPa; and a resin layer (B) having a tensile elasticity at 60°C, E6 (60), of 1 Mpa or more and having a thickness of 0.1 pm to less than 100 pm, the EB (60) being larger that EA (60) of the resin layer A. Figure 1</p> |
