| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wire bonding method which allows low profile, functional improvement, down-sizing, and systematization of a circuit device having a multichip module structure, and to provide a circuit device and a circuit device packaging method. <P>SOLUTION: The bonding method using a wire coated with an insulation film includes a step (a) for forming a ball 220 at the start end, i.e. a free end, of the wire coated with an insulation film, a step (b) for performing first bonding by using the ball thus formed, a step (c) for removing the coating at a part of the wire coated with an insulation film where the first bonding has being performed, and removing the coating at the end part of the wire coated with an insulation film where the second bonding is performed, and a step (d) for performing second bonding. The circuit device is manufactured by utilizing the bonding method using such a wire coated with an insulation film. Formation of balls and removal of the coating may also be performed for the second bonding. <P>COPYRIGHT: (C)2012,JPO&INPIT |
