发明名称 PHOTOSENSITIVE RESIN COMPOSITION, APPLICATIONS AND USAGE THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide a cured film which achieves contrast improvement in developing during a lithography process and attains excellent smoothness by preventing, in drying thereafter, foaming, swelling, peeling or the like of the coating film. <P>SOLUTION: A photosensitive resin composition includes (A) amide acid obtained by reacting (a) a compound including two or more amino groups in one molecule with (b) a compound including two or more dibasic acid anhydride groups in one molecule, (B) a polyamide resin with a phenolic hydroxyl group, and (C) a photoacid generator. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012163712(A) 申请公布日期 2012.08.30
申请号 JP20110023227 申请日期 2011.02.04
申请人 NIPPON KAYAKU CO LTD 发明人 HORIGUCHI TAKAFUMI;KOFUCHI KATSUMI;OGI SATOSHI;SEKINE KENJI
分类号 G03F7/023;C08G69/32;G03F7/004;H01L21/027;H05K3/28 主分类号 G03F7/023
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