| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface coating method which suppresses abnormal growth of plating due to conductive impurities on an insulation film without causing damage to electric wiring and the insulation film, and to provide a semiconductor device and a mounting circuit board which are manufactured by using the surface coating method. <P>SOLUTION: In a surface coating method, a surface coating material containing a water soluble resin, an organic solvent, and water is applied to a laminate body having an insulation film exposed on the surface of the laminate body and metal wiring exposed on the surface of the laminate body and formed by patterning so as to cover at least the surface of the insulation film, and a coat is formed on the surface of the insulation film. <P>COPYRIGHT: (C)2012,JPO&INPIT |
