| 摘要 |
<P>PROBLEM TO BE SOLVED: To thin an insulation layer covering a wiring pattern as much as possible. <P>SOLUTION: A wiring pattern 1 comprises first wiring 2 having a first pair of terminals 3, 4 and a plurality of first routing parts 5 connecting the first pair of terminals 3, 4, and second wiring 6 having a second pair of terminals 7, 8 and at least one second routing part 9 connecting the second pair of terminals 7, 8. <P>COPYRIGHT: (C)2012,JPO&INPIT |
