发明名称 |
GROUP III NITRIDE SEMICONDUCTOR ELECTRONIC DEVICE, EPITAXIAL SUBSTRATE, AND METHOD OF MANUFACTURING GROUP III NITRIDE SEMICONDUCTOR ELECTRONIC DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a group III nitride semiconductor electronic device in which a semiconductor layer, which isolates a gate electrode from a current path in a semiconductor stack, can be made thicker. <P>SOLUTION: A second semiconductor layer 15 is provided on a first semiconductor layer 13. A gate electrode 17 is provided on the second semiconductor layer 15. The first semiconductor layer 13 is provided on a semiconductor surface 21a composed of Al<SB POS="POST">X</SB>Ga<SB POS="POST">1-X</SB>N (0<X≤1). The band gap E15 of a second group III nitride semiconductor material is larger than the band gap E13 of a first group III nitride semiconductor material. The first group III nitride semiconductor material of the first semiconductor layer 13 is different from the Al<SB POS="POST">X</SB>Ga<SB POS="POST">1-X</SB>N, and the first semiconductor layer 13 includes distortion. The thickness T15 of the second semiconductor layer 15 is larger than the critical film thickness defined by the composition of the first group III nitride semiconductor material that is distortionless and the composition of the second group III nitride semiconductor. The first semiconductor layer 13 includes distortion, and is lattice-relaxed on the Al<SB POS="POST">X</SB>Ga<SB POS="POST">1-X</SB>N of the semiconductor surface 21a. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012164886(A) |
申请公布日期 |
2012.08.30 |
申请号 |
JP20110025375 |
申请日期 |
2011.02.08 |
申请人 |
SUMITOMO ELECTRIC IND LTD |
发明人 |
HASHIMOTO MAKOTO;AKITA KATSUSHI;AMANO HIROSHI;IWATANI MOTOAKI |
分类号 |
H01L21/338;H01L21/205;H01L29/778;H01L29/812 |
主分类号 |
H01L21/338 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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