摘要 |
A method of fabricating a semiconductor package structure is provided that includes: providing a chip having an active surface and a plurality of conductive bumps formed on the active surface, and a base substrate having an underfill layer formed on a surface thereof; attaching the active surface of the chip to the underfill layer, such that the conductive bumps are embedded in the underfill layer; removing the base substrate to expose the underfill layer; and attaching the chip to a package substrate via the underfill layer, such that the chip is electrically connected to the package substrate by the conductive bumps. Since the underfill layer is attached to the active surface of the chip first, and the underfill layer is provided on the package substrate, performing a soldering process is not needed, material cost is decreased, and the fabrication process is simplified.
|