| 摘要 |
Provided is an inspecting apparatus which can detect a pattern shape change in the depth direction. The inspecting apparatus is provided with: an illuminating unit (20), which illuminates a wafer (5) with illuminating light that can be transmitted through the wafer (5), said wafer having regular patterns formed thereon; a reflected diffraction light detecting unit (30), which receives reflected diffraction light formed by having the illuminating light diffracted by the patterns and reflected to the side illuminated with the illuminating light, and which outputs a first detection signal; a transmitted diffraction light detecting unit (40), which receives transmitted diffraction light formed by having the illuminating light diffracted by the patterns and transmitted to the rear side that is the reverse side of the surface illuminated with the illuminating light, and which outputs a second detection signal; and a signal processing unit (51), which detects states of the patterns on the basis of the first detection signal and/or the second detection signal. |
