APPARATUS AND METHOD FOR DIRECT WAFER BONDING

摘要

An apparatus (200) for direct wafer bonding between two wafers (20, 30) comprises at least one wafer carrier device (210) comprising a support (211) constituted a support element (2110) for receiving one of the two wafers, and aligning elements (220, 230, 240) placed around said chuck. The support element (2110) of the chuck (211) has an overall contact surface area that is smaller than the surface area of the wafer (20) to be supported by the support element (2110).