| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing a power module substrate capable of preventing lowering of a junction reliability and an appearance quantity at the time of soldering electronic parts, and a method for manufacturing the same. <P>SOLUTION: The apparatus for manufacturing the power module substrate comprises a pressurizing device 110 for pressurizing stacked multiple laminates 30, each of which is formed by laminating a ceramic substrate 2 and metal layers 6 and 7 with a first brazing material disposed therebetween, in the thickness direction; and a cushion sheet 40 which is formed by brazing carbon layers 42 on both sides of a graphite layer 41 with a second brazing material and is placed between the stacked multiple laminates 30. The manufacturing apparatus brazes the ceramic substrate 2 and the metal layers 6 and 7 to manufacture the power module substrate 3, the second brazing material has a larger affinity for oxygen in comparison to a material forming the metal layers 6 and 7, and contains a metal material having the evaporation temperature lower than a solidus temperature of the first brazing material, at a degree of vacuum at the time of jointing. <P>COPYRIGHT: (C)2012,JPO&INPIT |
