发明名称 HORIZONTAL TRANSPORTATION TYPE ELECTROLYTIC PLATING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a horizontal transportation type electrolytic plating apparatus in which an upper anode and an upper jet discharge pipe can be changed to a favorable arrangement position according to a change of a width interval of a transportation passage of each of plate objects to be treated whose width sizes are different from one another. <P>SOLUTION: In a horizontal transportation type electrolytic plating apparatus, a fixed anode 31 and a movable anode 32 facing each other are arranged to be shifted vertically with each other so that the fixed anode and the movable anode can be overlapped at an end side of each of the fixed and movable anodes, and thereby an upper anode 30 comprising the fixed anode and the movable anode can be arranged according to a width of a horizontally transported plate object P to be treated. Similarly, a fixed discharge pipe 41 and a movable discharge pipe 42 facing each other are arranged to be shifted vertically with respect to each other, and thereby an upper jet discharge pipe 40 comprising the fixed discharge pipe and the movable discharge pipe can be arranged according to a width of a horizontally transported plate object P to be treated. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012162790(A) 申请公布日期 2012.08.30
申请号 JP20110025968 申请日期 2011.02.09
申请人 MARUNAKA KOGYO KK 发明人 NAGAKURA MASAJI
分类号 C25D17/00;C25D17/08;C25D21/00 主分类号 C25D17/00
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