发明名称 ARRANGEMENT STRUCTURE OF WIRING BODY, MOBILE PHONE, AND WIRING COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide an arrangement structure of a wiring body capable of imparting waterproofness while wiring in a housing without using a die, and to provide a mobile phone and a wiring component using it. <P>SOLUTION: The arrangement structure of a wiring body includes a heat-shrinkable tube 5, and wiring body insertion openings 41h and 43h of projections 41d and 43d provided in housings 41 and 43. A flexible printed wiring board 3 is located to pass through the heat-shrinkable tube 5 and the wiring body insertion openings 41h and 43h. The heat-shrinkable tube shrinks and adheres to the projections 41d and 43d at the wiring body insertion openings, and the heat-shrinkable tube portion therebetween passes the wiring body in non-tight contact state. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012165001(A) 申请公布日期 2012.08.30
申请号 JP20120091151 申请日期 2012.04.12
申请人 SUMITOMO ELECTRIC IND LTD 发明人 KOYAMA KEIJI;MISHIMA HIDEHIKO
分类号 H05K7/00;H04M1/02 主分类号 H05K7/00
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