发明名称 |
ARRANGEMENT STRUCTURE OF WIRING BODY, MOBILE PHONE, AND WIRING COMPONENT |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide an arrangement structure of a wiring body capable of imparting waterproofness while wiring in a housing without using a die, and to provide a mobile phone and a wiring component using it. <P>SOLUTION: The arrangement structure of a wiring body includes a heat-shrinkable tube 5, and wiring body insertion openings 41h and 43h of projections 41d and 43d provided in housings 41 and 43. A flexible printed wiring board 3 is located to pass through the heat-shrinkable tube 5 and the wiring body insertion openings 41h and 43h. The heat-shrinkable tube shrinks and adheres to the projections 41d and 43d at the wiring body insertion openings, and the heat-shrinkable tube portion therebetween passes the wiring body in non-tight contact state. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012165001(A) |
申请公布日期 |
2012.08.30 |
申请号 |
JP20120091151 |
申请日期 |
2012.04.12 |
申请人 |
SUMITOMO ELECTRIC IND LTD |
发明人 |
KOYAMA KEIJI;MISHIMA HIDEHIKO |
分类号 |
H05K7/00;H04M1/02 |
主分类号 |
H05K7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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