| 摘要 |
The present invention relates to an LED heat sink comprising a substrate, a heat-dissipating line formed on the upper surface of the substrate, and a heat conduction line formed at the lower surface of the substrate, wherein the center of LED heat sink has a hollow portion and the end thereof has a coupling protrusion. The thus-configured LED heat sink may effectively dissipate heat generated by an LED to the outside. Particularly, heat from the LED may be dissipated en masse through the center and side surface of the LED heat sink. The LED heat sink of the present invention has a complex structure formed by stacking multiple layers of horizontal heat-dissipating plates onto a vertical heat-dissipating plate. The LED heat sink of the present invention is also configured such that heat retention and contact resistances at contact surfaces are minimized, thereby exhibiting significantly high heat-dissipating effects with a narrow heat-dissipating area. |
