发明名称 |
METHOD OF MANUFACTURING SOLID-STATE IMAGING ELEMENT, SOLID-STATE IMAGING ELEMENT AND ELECTRONIC APPARATUS |
摘要 |
A method of manufacturing a solid-state imaging element includes: manufacturing an element chip in which photoelectric conversion units are arranged on a main surface side; preparing a base configured using a material with an expansion coefficient greater than the element chip and having an opening of which the periphery of the opening is shaped as a flat surface; expanding the base by heating, mounting the element chip on the flat surface of the base in a state where the opening of the base is covered; and three-dimensionally curving a portion corresponding to the opening in the element chip by cooling and contracting the base in a state where the element chip is fixed to the flat surface of the expanded base. |
申请公布号 |
US2012217606(A1) |
申请公布日期 |
2012.08.30 |
申请号 |
US201213399113 |
申请日期 |
2012.02.17 |
申请人 |
ITONAGA KAZUICHIRO;SONY CORPORATION |
发明人 |
ITONAGA KAZUICHIRO |
分类号 |
H01L27/146;H01L31/0352;H01L31/18 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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