| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method and a semiconductor device which can form a semiconductor chip applied with an adhesive sheet by dicing together with the adhesive sheet and inhibit deterioration in packaging reliability of the semiconductor chip with keeping a thermal stress relaxation function of the adhesive sheet. <P>SOLUTION: A semiconductor device manufacturing method comprises: a dicing step of forming a semiconductor chip (40) applied with an adhesive sheet (50) by dicing a semiconductor wafer (70) together with the adhesive sheet (50) in a state where the adhesive sheet (50) is applied to one surface (72) of the semiconductor wafer (70); and a fixing step of adhering and fixing the semiconductor chip (40) to a surface of a support member (30) by the adhesive sheet (50). The adhesive sheet (50) includes at least a porous layer (51) in which voids (51a) each having a diameter larger than a vapor particle size and smaller than a particle size of cutting water (W1) supplied during dicing are formed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
