发明名称 Semiconductor Light Emitting Diodes Having Multiple Bond Pads and Current Spreading Structures
摘要 A light emitting device includes a diode region comprising a first face and opposing edges, and a bond pad structure comprising at least three bond pads along only one of the opposing edges of the first face.
申请公布号 US2012217530(A1) 申请公布日期 2012.08.30
申请号 US201113034267 申请日期 2011.02.24
申请人 EDMOND JOHN ADAM;DONOFRLO MATTHEW;PYLES SHAWN 发明人 EDMOND JOHN ADAM;DONOFRLO MATTHEW;PYLES SHAWN
分类号 H01L33/36 主分类号 H01L33/36
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