发明名称 |
COPPER NANO PASTE, METHOD FOR FORMING THE COPPER NANO PASTE, AND METHOD FOR FORMING ELECTRODE USING THE COPPER NANO PASTE |
摘要 |
Provided is a copper nano paste that can be calcined at a relatively low temperature. The copper nano paste includes: a binder added in an amount of 0.1 to 30 parts by weight; an additive added in an amount of not more than 10 parts by weight; and copper particles added in an amount of 1 to 95 parts by weight, wherein the copper particles have a particle size of 150 nm or less, and the surfaces of the copper particles are coated with a capping material.
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申请公布号 |
US2012220072(A1) |
申请公布日期 |
2012.08.30 |
申请号 |
US201113311276 |
申请日期 |
2011.12.05 |
申请人 |
KIM DONG HOON;OH SUNG IL;KANG SUNG KOO;JUN BYUNG HO;SONG YOUNG AH;KIM SEONG JIN;CHUN BYOUNG JIN;SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM DONG HOON;OH SUNG IL;KANG SUNG KOO;JUN BYUNG HO;SONG YOUNG AH;KIM SEONG JIN;CHUN BYOUNG JIN |
分类号 |
H01L31/18;B05D3/02;B05D5/12;H01B1/22;H01L21/283;H05K3/12 |
主分类号 |
H01L31/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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