TUBE-SHAPED SPUTTERING TARGET

摘要

PURPOSE: A tube-shaped sputtering target is provided to equally form a microstructure across the thickness of a sputtering target and the surface of a jacket by manufacturing the sputtering target in the form of a layer. CONSTITUTION: A tube-shaped sputtering target has a carrier tube and an in-based sputtering material. The sputtering material is arranged in the carrier tube. A microstructure of the sputtering material has a mean particle size below 1mm measured as a mean diameter of the particles on the sputtering-roughened surface of the sputtering material. The sputtering material contains the fraction of 1wt.% of copper and/or gallium at maximum.