| 摘要 |
PURPOSE: A quality monitoring apparatus and method of a chip mounting process are provided to inspect mounting quality of a chip in real time by adding an electric signal when the chip is mounted. CONSTITUTION: A quality monitoring apparatus of a chip mounting process comprises a pick-up part(10), a detecting part(40), and a determining part(50). The pick-up part picks up a chip and mounts the chip on a substrate. The chip comprises a plurality of chip bumps. The detecting part detects conducting level of the chip and the substrate by supplying electricity through the pick-up part. The determining part determines the quality of the mounting of the chip based on the conducting level detected by the detecting part. |
