发明名称 MIXTURE OF THERMOSETTING COMPOUND, CURABLE COMPOSITION, AND CONNECTION STRUCTURE
摘要 <P>PROBLEM TO BE SOLVED: To provide a mixture of a thermosetting compound excellent in storage stability. <P>SOLUTION: The mixture of a thermosetting compound includes: a thermosetting compound shown by formula (1-1); and an isomer of the thermosetting compound shown by the formula (1-1), or includes: a thermosetting compound shown by formula (2-1); and an isomer of the thermosetting compound shown by formula (2-1), or includes a thermosetting compound shown by formula (3-1); and an isomer of the thermosetting compound shown by the formula (3-1). <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012162591(A) 申请公布日期 2012.08.30
申请号 JP20110021665 申请日期 2011.02.03
申请人 SEKISUI CHEM CO LTD 发明人 YAMAGIWA HITOSHI;SHIMAOKA JUNICHI
分类号 C08G59/20;C08G75/08 主分类号 C08G59/20
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