VIA STRUCTURE AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To form a substrate through via with a smaller diameter.

SOLUTION: The structure comprises a first hole part 102 formed at a depth in a desired range of a hole diameter from a main surface 101a side, on which a circuit of a substrate 101 is formed; a second hole part 103 formed from a rear face of the substrate 101 and connected to the first hole part 102; a first hole part wiring 104 formed inside the first hole part 102; a surface wiring layer 105 connected to the first hole part wiring 104 and formed on the main surface 101a side of the substrate 101; a second hole part wiring 106 connected to the first hole part wiring part 104 and formed inside the second hole part 103; and a rear face wiring layer 107 connected to the second hole wiring 106 and formed on the rear face of the substrate 101.

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