发明名称 |
WAFER FURNACE WITH VARIABLE FLOW GAS JETS |
摘要 |
A method of forming a sheet wafer 1) passes at least two filaments through a molten material to produce a partially formed sheet wafer, 2) directs a cooling fluid at a flow rate toward the partially formed sheet wafer to convectively cool a given portion of the partially formed sheet wafer, and 3) monitors the thickness of the given portion of the partially formed sheet wafer. To ensure appropriate thicknesses of the wafer, the method controls the flow rate of the cooling fluid as a function of the thickness of the given portion of the partially formed sheet wafer.
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申请公布号 |
CA2828228(A1) |
申请公布日期 |
2012.08.30 |
申请号 |
CA20122828228 |
申请日期 |
2012.02.23 |
申请人 |
MAX ERA, INC. |
发明人 |
VAN GLABBEEK, LEO;LIU, LIANGHONG;HUANG, WEIDONG;HITCHCOCK, DAVID;YAMARTINO, STEPHEN |
分类号 |
B29C39/14;B29C51/42 |
主分类号 |
B29C39/14 |
代理机构 |
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代理人 |
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地址 |
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