发明名称 METHOD FOR MANUFACTURING SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a substrate, capable of suppressing generation of voids, enhancing its joint strength, and reducing its manufacturing cost. <P>SOLUTION: A method for manufacturing a substrate 10 is a method for manufacturing the substrate 10 made by joining a first substrate 1 and a second substrate 2 and includes the following steps: the first substrate 1 having one surface 1a irradiated with a rare gas plasma and the second substrate 2 having one surface 2a irradiated with an oxygen plasma are prepared; and the one surface 1a of first substrate 1 and the one surface 2a of the second substrate 2 are made to face each other, and the first substrate 1 and the second substrate 2 are pasted together in the atmosphere to be temporarily joined. The first substrate 1 and the second substrate 2, which are in the temporarily joined state, are joined by heating. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012161831(A) 申请公布日期 2012.08.30
申请号 JP20110025827 申请日期 2011.02.09
申请人 MITSUBISHI ELECTRIC CORP 发明人 SODA SHINNOSUKE
分类号 B23K20/00;B23K20/24;H01L21/02;H01L21/304 主分类号 B23K20/00
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