| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve transfer of a signal at a speed prescribed by a standard, and to prevent malfunction in a semiconductor device and an electronic equipment incorporating the same. <P>SOLUTION: To a conductor wiring layer 106 of a first semiconductor element 101, a signal line conductor 113a connecting between a signal terminal 103 of a package substrate 100 and a signal terminal 117 of a second semiconductor element 102, and a power supply conductor 114 connecting a power supply terminal 104 of the package substrate 100 and a power supply terminal 118 of the second semiconductor element 102, are formed so that the signal line conductor 113a, in the conductor wiring layer 106, is sandwiched by the power supply conductors 114 adjacent in a horizontal direction at a constant interval from the signal line conductor 113a. <P>COPYRIGHT: (C)2012,JPO&INPIT |
