发明名称 |
Carrier Device, Arrangement Comprising such a Carrier Device, and Method for Patterning a Layer Stack Comprising at Least One Ceramic Layer |
摘要 |
A method for patterning a layer stack with at least one ceramic layer includes providing the ceramic layer, which has at least one plated-through hole. An electrically conductive layer is applied above the ceramic layer, such that the electrically conductive layer is electrically coupled to the at least one plated-through hole. A further layer is deposited onto the electrically conductive layer in the region of the at least one plated-through hole, wherein the further layer includes nickel. The electrically conductive layer is removed outside the region of the at least one plated-through hole. A carrier device patterned in this way can be electrically and mechanically coupled to an electronic component.
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申请公布号 |
US2012218728(A1) |
申请公布日期 |
2012.08.30 |
申请号 |
US201013391974 |
申请日期 |
2010.08.11 |
申请人 |
BRUNNER SEBASTIAN;FUCHS GERHARD;FISCHER ANNETTE;FISCHER MANFRED;FAISTAUER CHRISTIAN;PUDMICH GUENTER;PAYR EDMUND;HATZL STEFAN LEOPOLD;EPCOS AG |
发明人 |
BRUNNER SEBASTIAN;FUCHS GERHARD;FISCHER ANNETTE;FISCHER MANFRED;FAISTAUER CHRISTIAN;PUDMICH GUENTER;PAYR EDMUND;HATZL STEFAN LEOPOLD |
分类号 |
H05K7/00;C25D5/02;H05K1/09 |
主分类号 |
H05K7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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