发明名称 |
LIGHT EMITTING DIODE PACKAGE AND LIGHT EMITTING DEVICE HAVING THE SAME |
摘要 |
An LED package includes a light transmissive encapsulation, an LED die embedded in the encapsulation from a bottom surface of the encapsulation, a positive electrode electrically connected to an anode of the LED die, and a negative electrode electrically connected to a cathode of the LED die. The encapsulation includes a light emitting surface opposite to the bottom surface thereof. The LED die includes a front surface for outputting light outward, and a back surface opposite to the front surface. The front surface is covered by the encapsulation and faces the light emitting surface of the encapsulation. The back surface is exposed outside. A light emitting device is provided by mounting the LED package to a circuit board. The circuit board has a heat conductor connecting with the LED die.
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申请公布号 |
US2012217525(A1) |
申请公布日期 |
2012.08.30 |
申请号 |
US201113283605 |
申请日期 |
2011.10.28 |
申请人 |
CHAN SHIUN-WEI;KE CHIH-HSUN;CHANG CHAO-HSIUNG;ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. |
发明人 |
CHAN SHIUN-WEI;KE CHIH-HSUN;CHANG CHAO-HSIUNG |
分类号 |
H01L33/60 |
主分类号 |
H01L33/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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