JUNCTION DEVICE, JUNCTION SYSTEM AND JUNCTION METHOD

摘要

The present invention is a junction device for joining substrates to one another that has: a first holding member for causing a first substrate to adhere to and be held on the lower surface thereof; a second holding member that is provided below the first holding member, and has a second substrate mounted on the upper surface thereof and held thereon; a pushing member that is positioned on the first holding member and applies pressure to the center section of the first substrate by pushing thereon; and a guiding member that adheres to and holds the first substrate, fixes the location of the first substrate in the horizontal direction, and is capable of movement in the vertical direction.