发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To improve controllability of the shape of contacts formed in insulating films having different film characteristics in a method of manufacturing a semiconductor device. <P>SOLUTION: A method of manufacturing a semiconductor device comprises the steps of: forming element regions on a semiconductor substrate; forming a first insulating film on a first region of the semiconductor substrate; forming a second insulating film, on a second region of the semiconductor substrate, having a different membrane stress and a different etching rate during etching in forming contacts from the first insulating film; selectively irradiating a contact region in which the contacts are formed with UV light in at least the second insulating film; and after the irradiation of the UV light, forming the contacts by etching the first insulating film and the second insulating film. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012164810(A) 申请公布日期 2012.08.30
申请号 JP20110023998 申请日期 2011.02.07
申请人 TOSHIBA CORP 发明人 SAKANAKA TOSHINORI;FUJITA KEIJI
分类号 H01L21/768;H01L21/28;H01L21/3065;H01L21/316;H01L21/318;H01L21/336;H01L29/78 主分类号 H01L21/768
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