SOLDER ALLOY FOR POWER DEVICE AND SOLDERED JOINT OF HIGH CURRENT DENSITY

摘要

A soldered joint capable of withstanding a high current density without the occurrence of electromigration such that it can be used in a power device and the like is formed from an Sn-Ag-Bi-In alloy. This soldered joint is formed from a solder alloy that essentially comprises 2 to 4 mass% of Ag, 2 to 4 mass% of Bi, 2 to 5 mass% of In, and Sn as the balance. This solder alloy can also contain one or more selected from Ni, Co, and Fe.